Electroplating of low-stress nickel

Details Electroplating of low-stress nickel Electroplating of low-stress nickel

C - Chemistry, Metallurgy

25

D

C25D 3/12 (2006.01) C25D 3/02 (2006.01) C25D 7/06 (2006.01) C25D 21/14 (2006.01)

Patent

CA 2236933

Nickel and nickel alloys can be electroplated from an aqueous acidic solution containing nickel alkane sulfonic acid and a stress-reducing additive that imparts compressive stress to an electrodeposit. The electroplating bath isacidic with a pH of 0 to 5.

Électrodéposition de nickel ou d'alliages de nickel à partir d'une solution aqueuse acide renfermant du nickel et de l'acide alcanesulfonique, ainsi qu'un additif réducteur de contrainte communiquant une contrainte de compression à un dépôt galvanoplastique. Le bain d'électrodéposition a un pH acide de 0-5.

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