Electroplating of rhodium-ruthenium alloys

C - Chemistry – Metallurgy – 25 – D

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204/26

C25D 3/56 (2006.01)

Patent

CA 1050471

RHODIUM-RUTHENIUM ALLOYS ABSTRACT OF THE DISCLOSURE Disclosed is an electroplating bath suitable for depositing a rhodium-ruthenium alloy containing at least 90 weight % rhodium. Rhodium and ruthenium axe present in the plating bath in the form of soluble platable compounds in a preferred weight ratio of at least about 10:1. The deposits obtained by this bath exhibit improved brightness over comparable baths even without the addition of lead, and also exhibit reduced stress as compared to deposits obtained from rhodium- platinum baths.

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