Electroplating palladium

Details Electroplating palladium Electroplating palladium

C - Chemistry, Metallurgy

25

D

204/29.5

C25D 3/50 (2006.01)

Patent

CA 1089796

Abstract 1. A method of electroplating palladium on a substrate comprises passing an electric current between an anode and the substrate in a bath comprising an aqueous solution of palladium diammonium dinitrite (Pd (NH3)2 (NO2)2) and tetrapotassium pyrophosphate. In a preferred method the electric current passes at a current density of 2 to 50 ASF (0.2 to 5.4 ASD) in a bath containing 4 to 18 gpl of palladium and 5 to 300 gpl of tetrapotassium pyrophosphate, the solution being at a pH of 8.5 to 11 and being maintained by the addition of pyrophosphoric acid or potassium hydroxide. The baths for the electrodeposition of palladium also form part of the invention.

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