Electroplating process

Details Electroplating process Electroplating process

C - Chemistry, Metallurgy

25

D

204/30, 204/26.5

C25D 3/12 (2006.01) C25D 3/14 (2006.01) C25D 3/56 (2006.01)

Patent

CA 1070637

Abstract of the Disclosure - This invention relates to a process and composition for the preparation of an electrodeposit which contains; at least one metal selected from the group consisting of nickel and cobalt or; binary or ternary alloys of the metals selected from nickel, iron, and cobalt; which comprises passing current from an anode to a cathode through an aqueous acidic electroplating solution containing at least one member selected from nickel compounds and cobalt compounds and which may additionally contain iron compounds providing nickel, cobalt and iron ions for electro- depositing nickel, cobalt, nickel-cobalt alloys, nickel-iron alloys, cobalt-iron alloys or nickel-iron-cobalt alloys and containing an effective amount of at least one additive; the improvement comprising the presence of 10 micromoles per compound or salt thereof having the formula: R1-S-S-R2 wherein R1 and R2 are independently selected from Image , and Image where n is an integer from 0 to 5, X1 is selected from -OH, -NH2, Image , and Image or salts thereof and X2, X3 and X4 are independently selected from -H, -OH, -NH2, Image , and simultaneously hydrogen; for a time period sufficient to form a metal electroplate upon said cathode. - i -

261686

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