Electroplating process

Details Electroplating process Electroplating process

C - Chemistry, Metallurgy

25

D

204/18, 204/12.5

C25D 5/54 (2006.01) C25D 5/02 (2006.01) H05K 3/18 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1332817

A method for metal plating the surface of an article formed from a nonconductor. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

571292

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