Electroplating process

C - Chemistry – Metallurgy – 25 – D

Patent

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C25D 5/56 (2006.01) H05K 3/10 (2006.01) H05K 3/18 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1294425

ABSTRACT A liquid dispersion suitable for use in en- hancing the electroplating of a non-conducting surface comprised of: (a) carbon black particles having an average particle size of less than about 3.0 microns in said dispersion; (b) an effective dispersing amount of a sur- factant which is compatible with said carbon black; (c) a sufficient amount of at least one alka- line hydroxide to raise the pH of said liquid dispersion in the range from about 10 to 14; and (d) liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non- conducting surface and is less than about 4% by weight of said liquid dispersion and wherein said liquid dispersion contains less than about 10% by weight solids con- stituents. The dispersion is useful for electroplating a conductive metal layer to the surface of a non-conduc- tive material by applying the dispersion to the surface of the non-conducting material, separating substantially all of the liquid dispersing medium from the carbon black particles, whereby the particles are deposited on the non-conductive surface in a substantially continuous layer, and electroplating a substantially continuous conductive metal layer over the deposited carbon black layer and the non-conductive surface.

615622

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