Electroplating process

Details Electroplating process Electroplating process

C - Chemistry, Metallurgy

25

D

31/157, 356/18

C25D 5/56 (2006.01) H05K 3/10 (2006.01) H05K 3/18 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1272594

Abstract of the Disclosure A process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises: (a) preparing a liquid dispersion of carbon black comprised of: (1) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and, (3) liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion; (b) applying said liquid dispersion to the surface of the non-conducting material; (c) separating substantially all of said liquid dispersing medium from said carbon black particles, whereby said particles are deposited on said non-conductive surface in a substantially continuous layer; and (d) electroplating a substantially continuous conductive metal layer over the deposited carbon black layer and said non-conductive surface.

503878

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