Electroplating process and apparatus

Details Electroplating process and apparatus Electroplating process and apparatus

C - Chemistry, Metallurgy

25

D

204/133, 204/12.

C25D 7/12 (2006.01) C25D 17/00 (2006.01) C25D 17/28 (2006.01) C25D 21/06 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2000492

ABSTRACT OF THE INVENTION A process and an apparatus for coating a printed circuit board in a horizontal position in a coating chamber by flooding the chamber while the printed circuit board is suspended horizontally in a coating chamber between at least two anodes with adjustable power applied to the anodes provides for a uniform coating of the board and the aperture therein.

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