Electroplating system and method

Details Electroplating system and method Electroplating system and method

C - Chemistry, Metallurgy

25

D

C25D 17/16 (2006.01) C25D 7/04 (2006.01) C25D 7/10 (2006.01) C25D 17/00 (2006.01) F16C 33/00 (2006.01)

Patent

CA 2559152

The present invention includes a method of electroplating an object, where the objects are stacked in at least one sleeve and the objects have an interior surface, that upon stacking, form a stack conduit. The sleeves are then racked to provide fluid communication between a plating solution reservoir and the stack conduit. Plating of the inner surfaces of the objects occurs by flowing an electroplating solution from the reservoir through the stack conduit in the presence of a current. The present invention also includes systems for carrying out the above method.

Cette invention concerne un procédé d'électrodéposition d'un objet selon lequel des objets sont empilés dans au moins un manchon, lesquels objets comprennent une surface intérieure qui, lors de l'empilement, forme un conduit de pile. Les manchons sont ensuite montés de façon qu'on obtienne une communication fluidique entre un réservoir de solution de galvanisation et le conduit de pile. La galvanisation des surfaces intérieures des objets consiste à faire couler une solution d'électrodéposition du réservoir à travers le conduit de pile en présence d'un courant. La présente invention concerne également des systèmes permettant de mettre en oeuvre le procédé décrit plus haut.

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