C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/133
C25D 21/08 (2006.01) C02F 1/04 (2006.01) C02F 1/46 (2006.01) C02F 9/00 (2006.01) C25D 17/00 (2006.01) C25D 21/20 (2006.01) C25F 7/02 (2006.01)
Patent
CA 1295283
AN IMPROVED ELECTROPLATING SYSTEM ABSTRACT An electroplating system with improved water use efficiency and unique waste water treatment which enables operation without access to public sewers thereby permitting compliance with governmental regulations regarding disposal of waste water. Water use efficiency is achieved by means of limited use governmental water sprays, multiple rinse tank backflow to the prior processs tank and water evaporation from said process tanks. In addition, all waste water not returned to the prior process tank locally at each plating subassembly is transferred to an inplant sump for common evaporative treatment.
499261
Hutchison Donald M.
Tenace Dominic
Kirby Eades Gale Baker
Tenace Dominic
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