C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/11
C25D 5/54 (2006.01) C25D 5/02 (2006.01) C25D 7/06 (2006.01) C25D 15/00 (2006.01) C25D 17/00 (2006.01) F01D 11/12 (2006.01) F16J 15/44 (2006.01)
Patent
CA 1267630
13DV-8627 IMPROVED ELECTROPLATING TAPE AND METHOD FOR USING ABSTRACT OF THE DISCLOSURE A method for applying preselected abrasive particles to a cleaned first article surface adjacent a second article surface selected to be substantially free of such abrasive particles includes disposing on the first article surface a first electrically non-conductive tape segment including pores large enough to allow passage of electrodeposition current and electrolyte solution but smaller than the size of abrasive particles to be retained on the first tape segment. The first segment has a porous adhesive layer of relatively low tack level, the adhesive carrying the abrasive particles through a first, relatively weak bond. A second electrically non-conductive tape segment substantially impervious to electrolyte solution and electroplating current and having adhesive on a second segment operating surface is disposed on the second article surface in a manner at least sharing an edge portion with the first segment. A metallic coating is electro- deposited through pores of the first tape segment onto the first article surface and about the abrasive particles held in contact with such surface to bond the particles to the first article surface through a second bond. Such bond between the metallic coating and the abrasive particles is stronger than the first, relatively weak bond. The first tape segment is separated at the first bond from the abrasive particles which remain bonded to the first article surface. An improved electroplating tape is a multisegment 13DV-8627 ABSTRACT OF THE DISCLOSURE (Cont'd) electrically non-conductive tape comprising the first tape segment and at least one second tape segment at least sharing an edge portion with the first tape segment.
486678
Company General Electric
Eckersley Raymond A.
LandOfFree
Electroplating tape and method for using does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electroplating tape and method for using, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating tape and method for using will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1263359