Electropolishing and/or electroplating apparatus and methods

Details Electropolishing and/or electroplating apparatus and methods Electropolishing and/or electroplating apparatus and methods

C - Chemistry, Metallurgy

25

D

C25D 5/48 (2006.01) C25D 7/12 (2006.01) C25D 17/00 (2006.01) C25F 3/30 (2006.01) C25F 7/00 (2006.01) H01L 21/00 (2006.01) H01L 21/288 (2006.01) H01L 21/683 (2006.01) H01L 21/687 (2006.01)

Patent

CA 2479794

In one aspect of the present invention, exemplary apparatus and methods are provided for electropolishing and/or electroplating processes for semiconductor wafers. One exemplary apparatus includes a cleaning module having an edge clean assembly (930) to remove metal residue on the bevel or edge portion of a wafer (901). The edge cleaning apparatus includes a nozzle head (1030) configured to supply a liquid and a gas to a major surface of the wafer, and supplies the gas radially inward of the location the liquid is supplied to reduce the potential of the liquid from flowing radially inward to the metal film formed on the wafer.

Dans un mode de réalisation, l'invention concerne un appareil et des procédés de polissage et/ou de placage électrolytiques de tranches semi-conductrices. Un appareil comprend un module de nettoyage comportant un assemblage (930) de nettoyage de bord destiné à éliminer des résidus métalliques sur le chanfrein ou sur la portion de bord d'une tranche (901). L'appareil de nettoyage de bord comprend une tête de buse (1030) conçue afin d'envoyer un liquide et un gaz sur une surface principale de la tranche. La buse envoie le liquide dans une région adjacente à la bordure extérieure de la surface principale de la tranche, et envoie le gaz radialement vers l'intérieur de l'emplacement d'envoi du liquide, afin de réduire la possibilité que le liquide s'écoule radialement vers l'intérieur du film métallique formé sur la tranche.

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