C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 5/46 (2006.01) B05D 1/04 (2006.01) C09D 177/02 (2006.01) C09D 177/06 (2006.01)
Patent
CA 2351929
Disclosed is a process which comprises coating a nonconducting molding with a thermoplastic or crosslinkable copolyamide hot-melt adhesive, wherein the coating takes place electrostatically. The coating may be applied by an electrostatic gun and a fine powder having a particle size of 1 to 200 µm of the hot-melt adhesive may be used. Further, the powder may be applied locally (e.g., in recesses) in a large amount.
Losensky Hans-Willi
Simon Ulrich
Waterkamp Paul-Ludwig
Degussa Ag
Degussa-Huls Aktiengesellschaft
Fetherstonhaugh & Co.
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