Electrostatic fluidized bath with semiconductor electrode

B - Operations – Transporting – 05 – C

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32/16.2

B05C 19/02 (2006.01) B05D 1/24 (2006.01)

Patent

CA 2192000

The invention relates to an electrostatic fluidized bath for coating substrates by means of powders which are charged electrostatically when contacting one or a plurality of semiconductor electrodes immersed in the fluidization vat. The semiconductor electrodes have a voluminal resistivity from 10<2> to 10<8> OMEGA .m, and preferably from 10<4> to 10<6> OMEGA .m. The coating of the substrates in such baths is particularly regular and uniform regardless of the geometry of substrate to be coated and is appropriate for large size substrates.

L'invention concerne un bain fluidisé électrostatique pour le revêtement de substrats à l'aide de poudres qui se chargent électrostatiquement au contact d'une ou plusieurs électrodes semi-conductrices plongées dans la cuve de fluidisation. Les électrodes semi-conductrices présentent une résistivité volumique comprise entre 10 2 et 10 8 .OMEGA..m, et de préférence comprise entre 10 4 et 10 6 .OMEGA..m. Le revêtement des substrats dans de tels bains est particulièrement régulier et uniforme, quelle que soit la géométrie du substrat à revêtir et convient pour des substrats de grande dimension.

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