Electrostatic sensitive component package

Details Electrostatic sensitive component package Electrostatic sensitive component package

H - Electricity

01

L

H01L 23/60 (2006.01) H05K 9/00 (2006.01) H05K 13/00 (2006.01)

Patent

CA 2148733

An electrostatic sensitive component package includes upper and lower layers of metallized plastic with an intermediate layer of an anti-stat support member such electrically conductive foam. An electrostatic sensitive component such as an integrated circuit is mounted against the foam. The metallized plastic layers and the foam are secured together by an ultrasonic seal to form a Faraday cage around the component and thus prevent electrostatic forces from reaching the component to thereby form an anti-stat package for the component. The resulting package may have an open side which is closed by an integral flap.

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