Electrostatically bonded dielectric-on-semiconductor device,...

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H01L 29/76 (2006.01) H01L 21/314 (2006.01) H01L 21/70 (2006.01) H01L 27/20 (2006.01) H01L 29/84 (2006.01) H01L 41/04 (2006.01) H03F 3/16 (2006.01)

Patent

CA 1060573

AN ELECTROSTATICALLY BONDED DIELECTRIC-ON- SEMICONDUCTOR DEVICE, AND A METHOD OF MAKING THE SAME ABSTRACT OF THE DISCLOSURE An electrostatically bonded dielectric-on semiconductor device, such as a ferroelectric field-effect transistor or amplifying acoustic surface wave transducer, is made with a dielectric body having properties selected from the group consisting of ferroelectricity and piezo- electricity. The dielectric body has opposed first and second major surfaces, with at least said first major surface of planar configuration to which a semiconductor body is electrostatically bonded. The semiconductor body is of a bulk material and a given conductivity type, and has first and second opposed major surfaces, with at least the first major surface of planar configuration where the semiconductor body is electrostatically bonded. At least one and typically a plurality of electrodes are positioned on the dielectric body to provide for interaction between transport carriers in the semiconductor body and electric polarization changes in the dielectric body. Preferably, the dielectric-on- semiconductor is made by the method described.

259093

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