Elimination of film defects due to hydrogen evolution during...

Details Elimination of film defects due to hydrogen evolution during... Elimination of film defects due to hydrogen evolution during...

C - Chemistry, Metallurgy

08

L

C08L 101/00 (2006.01) C08J 5/18 (2006.01) C09D 5/44 (2006.01) C25D 13/06 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2047552

Abstract of the Disclosure This invention is directed to a method for eliminating or reducing pinhole defects in cataphoretically deposited films without interfering with the electrolysis of water needed for electrodeposition. This method comprises decreasing the evolution of hydrogen gas at the cathode by adding a compound to the emulsion. This compound is reduced by the hydrogen produced at the cathode during the electrodeposition. The hydrogen reacts with the this non-gaseous compound rather than becoming hydrogen gas and forming bubbles which lead to pinhole defects.

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