Embedded catalyst receptors for metallization of dielectrics

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B32B 27/18 (2006.01) B32B 15/08 (2006.01) C23C 18/16 (2006.01) C23C 18/54 (2006.01) G03F 7/004 (2006.01) G03F 7/16 (2006.01) G03F 7/20 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1286792

TITLE PD-2341 EMBEDDED CATALYST RECEPTORS FOR METALLIZATION OF DIELECTRICS ABSTRACT The invention is directed to a laminate for the preparation of printed circuits by electroless plating of conductive metal thereon which comprises a. an electrically insulative substrate bearing b. an adherent layer of crosslinked polymeric adhesive, which is insoluble in photodielectric developing solutions, having partially embedded therein finely divided particles of adsorbent which protrude from the adhesive surface away from the substrate, the protrusive surfaces of which are adsorptive with respect to electroless plating catalysts or reductive precursors thereof, and c. a solid layer of photodielectric adherently overlying the layer of adhesive and adsorbent particles.

555096

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