Embedded rf vertical interconnect for flexible conformal...

Details Embedded rf vertical interconnect for flexible conformal... Embedded rf vertical interconnect for flexible conformal...

H - Electricity

01

Q

H01Q 1/38 (2006.01) H05K 1/02 (2006.01)

Patent

CA 2729740

A method of making an RF signal transition in a printed wiring board structure including a plurality of printed wiring board layers forming a multi-layer flexible laminate, comprises, forming a plurality of interconnected buried vias by precutting via holds in an adhesive layer intervening each printed wiring board prior to the lamination process and, filling the precut via holes in the adhesive layer with a conducting material that will set during the laminating process; precutting via holes in each of the respective printed wiring board layers and filing the precut via holes in each respective printed wiring board layer with a conducting material that will set during the laminating process; forming on each side of the respective printed wiring boards catch pads surrounding the respective via holes; and aligning the via holes in the adhesive layers with respective catch pad on at least one side of the respective adhesive layer.

Affiliated with

Also associated with

Rating

Embedded rf vertical interconnect for flexible conformal... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Embedded rf vertical interconnect for flexible conformal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Embedded rf vertical interconnect for flexible conformal... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1956422