Emi internal shield apparatus and methods

Details Emi internal shield apparatus and methods Emi internal shield apparatus and methods

H - Electricity

05

K

H05K 9/00 (2006.01)

Patent

CA 2110639

EMI SHIELD APPARATUS AND METHODS ABSTRACT OF THE DISCLOSURE A top cover and bottom cover made of an electrically conductive material that absorbs and reflects electromagnetic interference (EMI) signals are formed to fit without solder or welding as an EMI shield apparatus over EMI susceptible electronic circuitry on a printed circuit board. The EMI shield apparatus shields the circuitry from EMI while at the same time permitting the communication of desired electromagnetic radio frequency and electrical signals to the circuitry. The EMI shield apparatus includes the use of an electrically conductive layer that is integral to the top and bottom sides of the printed circuit board and which includes conductive channels that penetrate the printed circuit board. The channels prevent EMI from passing through the printed circuit board to the electronic circuitry. Also, the channels receive tangs found both on the top cover and bottom cover. The tangs are positioned to prevent EMI from passing through the top and bottom cover junctures with the conductive layer. As EMI signals reach the shield apparatus, they are absorbed and conducted through the shield EMI apparatus to an electrical ground or reflected from the EMI shield. Openings on the top cover permit desired electromagnetic radio frequency signals to reach the electronic circuitry. Passageways through the conductive layer permit electrical leads from the electronic circuitry to connect to external circuitry. 31

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