Emi shielding enclosures

H - Electricity – 05 – K

Patent

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Details

H05K 9/00 (2006.01)

Patent

CA 2328935

An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.

La présente invention concerne une enceinte de protection contre les perturbations électromagnétiques (EMI), destinée à un assemblage électronique, comprenant une plaque de masse d'un circuit imprimé reliée à une coiffe protégeant des perturbations électromagnétiques. La coiffe provient du thermoformage d'une feuille composite à plusieurs couches comprenant un support pour un mat de fibres métalliques dont les fibre sont pratiquement recouvertes d'un revêtement. La connexion entre la coiffe et la plaque de masse, de manière à former l'enceinte de protection contre les perturbations électromagnétiques, nécessite l'adhérence du revêtement de fibre au circuit imprimé au voisinage de la plaque de masse.

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