Emulsified phenol-formaldehyde resins

Details Emulsified phenol-formaldehyde resins Emulsified phenol-formaldehyde resins

C - Chemistry, Metallurgy

08

L

400/7317, 154/95

C08L 61/10 (2006.01) B27D 1/04 (2006.01) C09J 3/16 (1980.01)

Patent

CA 1038521

ABSTRACT OF THE DISCLOSURE A rapidly-curable room temparature-stable and mobile phenol-formaldehyde resin is provided in the form of an emulsion which has particular utility in panel board production, particularly waferboard production. The resin is formed by reaction of formaldehyde and phenol at a mole ratio of formaldehyde to phenol greater than about 1.7:1 in an aqueous reaction medium in the presence of a metal carboxylate catalyst therefor. Acid is added to the resin prior to its emulsification so that the resin is in an acid- catalyzed form in the emulsion. The resin has a viscosity of about 1000 to about 40,000 cps at about 24°C.

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