Emulsion binders containing low residual formaldehyde and...

Details Emulsion binders containing low residual formaldehyde and... Emulsion binders containing low residual formaldehyde and...

C - Chemistry, Metallurgy

08

F

C08F 218/08 (2006.01) C08F 4/40 (2006.01) C08F 18/08 (2006.01) D04H 1/64 (2006.01)

Patent

CA 2102481

The free formaldehyde content of the emulsion polymer, the amount of emitted formaldehyde and, even more particularly, of the finished nonwoven or textile may be substantially reduced by the use of a particular initiator system comprising a hydrophobic hydroperoxide and ascorbic acid. Moreover, this reduction in formaldehyde levels is accompanied by an unexpected improvement in the tensile properties of the emulsion binders.

Affiliated with

Also associated with

Rating

Emulsion binders containing low residual formaldehyde and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Emulsion binders containing low residual formaldehyde and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Emulsion binders containing low residual formaldehyde and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-2047068