Encapsulant composition for use in signal transmission devices

H - Electricity – 01 – B

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31/162

H01B 3/18 (2006.01) G02B 6/44 (2006.01) H01B 3/26 (2006.01) H01B 7/285 (2006.01)

Patent

CA 2003781

The invention relates to a grease compatible, hydrolytically stable dielectric encapsulant capable of being used to encapsulate a splice of a signal conducting device comprising: an extended reaction product of an admixture of a) an effective amount of an anhydride functionalized compound having reactive anhydride sites; b) an effective amount of a crosslinking agent capable of reacting with the anhydride sites of said compound to form a cured cross-linked material; and c) an effective amount of an oxirane containing material to provide hydrolytic stability; wherein said reaction product is extended with at least one plasticizer present in the range of between 5 and 95 percent by weight of the encapsulant and said at least one plasticizer is essentially inert with said reaction product and is substantially non-exuding therefrom; and said encapsulant having a C-H adhesion value of at least 4. The compositions are useful for encapsulating signal transmission devices.

L'invention porte sur un agent d'encapsulation, isolant, compatible avec les graisses et hydrolytiquement stable, pouvant être utilisé pour encapsuler un raccord d'un dispositif conducteur de signaux. Cet agent est un produit de réaction dilué, obtenu par addition : a) d'une quantité efficace d'un composé à fonction anhydre, comportant des sites anhydride réactifs; b) d'une quantité efficace d'un réticulant pouvant réagir avec les sites anhydride dudit composé pour former un matériau réticulé; c) d'une quantité efficace d'une substance à base d'oxirane permettant d'assurer la stabilité hydrolytique. Le produit de réaction est dilué avec au moins un plastifiant, présent à raison de 5 à 95 % en poids de l'agent d'encapsulation, ce plastifiant étant pratiquement inerte vis-à-vis dudit produit de réaction et n'exsudant pratiquement pas de ce dernier; l'agent d'encapsulation possède une valeur d'adhésion C-H d'au moins 4. Les compositions sont utiles pour encapsuler des dispositifs de transmission de signaux.

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