Encapsulant compositions based on anhydride-hardened epoxy...

Details Encapsulant compositions based on anhydride-hardened epoxy... Encapsulant compositions based on anhydride-hardened epoxy...

C - Chemistry, Metallurgy

08

L

400/1704, 400/40

C08L 63/00 (2006.01) C08L 35/00 (2006.01)

Patent

CA 1094706

INVENTION: ENCAPSULANT COMPOSITIONS BASED ON ANHYDRIDE- HARDENED EPOXY RESINS INVENTORS: HAROLD W. TULLER and RALPH W. NUSSBAUM ABSTRACT OF THE DISCLOSURE Epoxy molding compositions useful as semiconductor encapsulants, comprising (a) an epoxide compound; (b) as hardener, a polyanhydride of a maleic monomer and at least one alkyl styrene monomer or prepolymers of the polyanhydride and said epoxide compound; (c) a catalyst; (d) about 1 to 80 percent by weight of a silica filler; (e) about 1 to 80 percent by weight of an additional filler selected from the group consisting of calcined clay, antimony trioxide, antimony tetraoxide, calcium silicate, titanium dioxide, calcium carbonate, zinc oxide, magnesium oxide and mixtures thereof; (f) about 0.05 to 2 percent by weight of a silane coupling agent; and (g) about 0.01 to 2 percent by weight of a lubricant selected from the group con- sisting of carnauba wax, montanic acid ester wax, polyethylene wax, polytetrafluoroethylene wax and mixtures thereof.

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