Encapsulated electronic components and encapsulation...

Details Encapsulated electronic components and encapsulation... Encapsulated electronic components and encapsulation...

H - Electricity

01

B

400/3033, 400/41

H01B 3/30 (2006.01) C08L 81/02 (2006.01) H01C 1/034 (2006.01) H01L 23/29 (2006.01) H05K 5/06 (2006.01) C08L 9/00 (2006.01) C08L 25/10 (2006.01) C08L 53/02 (2006.01)

Patent

CA 1244173

Abstract of the Disclosure Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinyl- substituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer, reinforcement and filler.

440162

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