Encapsulated electronic sensor package

Details Encapsulated electronic sensor package Encapsulated electronic sensor package

H - Electricity

05

K

H05K 5/06 (2006.01) H05K 7/00 (2006.01)

Patent

CA 2482672

An electronic package includes a circuit board and a capsule layer encasing the circuit board and forming an immersible electronic module. A housing receives the electronic module and forms a protective shell around the electronic module.

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