Encapsulated optical package

Details Encapsulated optical package Encapsulated optical package

G - Physics

02

B

G02B 6/12 (2006.01) G02B 6/13 (2006.01) G02B 6/42 (2006.01)

Patent

CA 2569265

A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

L'invention concerne un procédé servant à élaborer une puce optoélectronique encapsulée. Ceci consiste à fixer la puce optoélectronique sur un substrat, à appliquer ensuite une substance de revêtement translucide sur ladite puce optoélectronique et à polir cette substance afin de l'enlever et d'effectuer un couplage optique.

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