Encapsulating a hollow three dimensional array of...

Details Encapsulating a hollow three dimensional array of... Encapsulating a hollow three dimensional array of...

B - Operations, Transporting

29

C

18/906

B29C 70/70 (2006.01) B29C 33/12 (2006.01) B29C 49/20 (2006.01)

Patent

CA 1051159

"MOULDING" ABSTRACT OF THE DISCLOSURE The invention relates to a method of producing an article comprising a hollow three dimensional array of reinforcement elements encapsulated in a thermoplastic material, whereby a hollow parison of said thermoplastic material is located within said array of rein- forcement elements, said reinforcement array being located in a mould spaced apart from the mould surface, and said parison being ex- panded into conformity with said mould surface to encapsulate said reinforcement by the production of a pressure drop across the wall of said parison.

217471

Affiliated with

Also associated with

Rating

Encapsulating a hollow three dimensional array of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulating a hollow three dimensional array of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulating a hollow three dimensional array of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1153182