Encapsulating compositions

Details Encapsulating compositions Encapsulating compositions

C - Chemistry, Metallurgy

08

L

400/5134, 400/73

C08L 63/04 (2006.01) C08G 59/06 (2006.01) C08G 59/42 (2006.01) C08K 3/36 (2006.01) C08L 63/00 (2006.01) H01B 3/40 (2006.01)

Patent

CA 1257434

ABSTRACT Electrical/electronic encapsulating compounds are prepared from reinforced epoxy resin compositions comprising (A) a filler material such as silica flour, (B) one or more epoxy resins at least one of which is a hydrocarbon novolac epoxy resin such as a phenol-dicy- clopentadiene epoxy novolac resin and (C) one or more epoxy resin curing agents such as phenol-formaldehyde novolac resin. These compositions are particularly suitable for use in electrical applications such as the encapsulation and subsequent protection of electrical and micro electronic devices and circuitry.

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