Encapsulating compositions containing ultra-pure,...

Details Encapsulating compositions containing ultra-pure,... Encapsulating compositions containing ultra-pure,...

C - Chemistry, Metallurgy

08

K

400/7044, 400/79

C08K 3/36 (2006.01) C09C 1/30 (2006.01) H01L 23/29 (2006.01)

Patent

CA 1317696

ABSTRACT OF THE DISCLOSURE Compositions for encapsulating electronic components are provided which comprise a blend of a curable resin and an ultra-pure silica filler. The filler is composed of fused silica granules which are prepared from a gel of a silicon-containing organic compound, such as TEOS, and which have a uranium content of less than about 0.1 parts per billion and a thorium content of less than about 0.5 parts per billion. The compositions can be readily manufactured in commercial quantities at reasonable costs and are particular well-suited for encapsulating components, such as, high density RAMs, which are sensitive to alpha particles.

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