Encapsulation for an electronic component and a process for...

Details Encapsulation for an electronic component and a process for... Encapsulation for an electronic component and a process for...

H - Electricity

01

L

H01L 21/50 (2006.01) H03H 9/10 (2006.01)

Patent

CA 2399417

Sensitive component structures (2) can be encapsulated by enclosing them with a frame structure (6) consisting of a light-sensitive reaction resin and covering the latter with another, structured layer of reaction resin after applying an auxiliary film (7). Top structures (10) which fit over the frame structures (6) can be produced e.g., by structured imprinting or photostructuring. The residual parts of the exposed auxiliary film are removed by dissolving or etching.

Pour encapsuler des structures composants sensibles (2), on les enveloppe dans une structure cadre (6) en résine de réaction photosensible que l'on recouvre d'une autre couche de résine de réaction (8) après application d'un film auxiliaire (7). Sur les structures cadres (6), on peut former des structures supérieures (10) adaptées, par exemple, par impression structurée ou photostructuration. Les restes du film auxiliaire découvert sont enlevés par dissolution ou attaque chimique.

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