Encapsulation method

Details Encapsulation method Encapsulation method

B - Operations, Transporting

05

D

117/112

B05D 1/18 (2006.01) B05D 5/12 (2006.01) H01F 27/32 (2006.01) H01F 41/00 (2006.01)

Patent

CA 1036434

TITLE OF THE INVENITON Encapsulation Method ABSTRACT OF THE DISCLOSURE Encapsulation method not requiring molds and according to which curing of a thermosetting substance which when hardened provides requisite protection to an electrical or other assembly consisting of one or a plurality of ele- ments is effected while the assembly is surrounded by a substance which remains solid and prevents movement of the thermosetting substance out of contact with the assembly during thermoplastic stages of curing thereof, and melts when the thermosetting substance has hardened, whereby the assembly may be moved out of contact therewith.

236264

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