Encapsulation of a device

H - Electricity – 01 – L

Patent

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Details

H01L 31/12 (2006.01) H01L 51/52 (2006.01) H05B 33/00 (2006.01) H05K 5/02 (2006.01) H01L 27/32 (2006.01) H01L 33/00 (2006.01)

Patent

CA 2342946

An encapsulation for an electrical device (100) is disclosed. A cap support (130) is provided in the non-active regions (120) of the device (100) to prevent the package from contacting the active components (110) of the device due to mechanical stress induced in the package.

L'invention concerne l'encapsulation d'un dispositif électrique (100). Un support de capsule (130) est fournit dans les zones non-actives (120) du dispositif (100) de manière à empêcher le boîtier d'entrer en contact avec les éléments actifs (110) du dispositif sous l'effet des contraintes mécaniques induite dans le boîtier.

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