Encapsulation of electronic components

Details Encapsulation of electronic components Encapsulation of electronic components

B - Operations, Transporting

29

C

18/908

B29C 39/10 (2006.01) B29C 45/00 (2006.01) B29C 45/14 (2006.01) C08G 63/60 (2006.01) C08K 3/36 (2006.01) C08L 77/12 (2006.01) H01B 3/42 (2006.01) H01L 23/29 (2006.01)

Patent

CA 1283270

IMPROVEMENTS IN THE ENCAPSULATION OF ELECTRONIC COMPONENTS Abstract of the Disclosure An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding compo- sition comprises a melt processable thermotropic liquid crys- talline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 20,000 (e.g. approx- imately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advanta- geously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated in a semiconductor device, such as a relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is en- capsulated. The resulting encapsulated electronic component is well protected in spite of the relatively low molecular weight of the liquid crystalline polymer and is capable of satis- factory service for an extended period of time even if adverse environmental conditions are encountered. A rugged commonly non-burning and relatively inexpensive package is provided.

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