Encapsulation of electronic components with a thermosetting...

Details Encapsulation of electronic components with a thermosetting... Encapsulation of electronic components with a thermosetting...

B - Operations, Transporting

29

C

18/60, 18/683

B29C 45/00 (2006.01) C08G 73/12 (2006.01) H01C 1/034 (2006.01) H01C 17/02 (2006.01) H01L 21/312 (2006.01) H01L 23/29 (2006.01)

Patent

CA 1165072

PRECIS DE LA DIVULGATION: L'invention concerne un procédé d'encapsulation de composants électroniques à l'aide d'une matière à mouler à base d'un prépolymère thermodurcissable. La caractéristique dudit procédé réside dans le fait que la matière à mouler: (a) un prépolymère de bis-imide et de polyamine, (b) un initiateur de polymérisation radicalaire, et (c) des charges. Le procédé de l'invention est conduit en faisant appel aux méthodes de moulage par transfert ou par injection.

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