Encapsulation of electronic components with calcium...

Details Encapsulation of electronic components with calcium... Encapsulation of electronic components with calcium...

C - Chemistry, Metallurgy

08

L

400/8105

C08L 81/02 (2006.01) C08K 3/34 (2006.01) C08K 5/54 (2006.01) C08K 7/10 (2006.01) H01B 3/30 (2006.01) H01C 1/034 (2006.01) H01L 21/56 (2006.01) H01L 23/29 (2006.01) H05K 5/06 (2006.01)

Patent

CA 1235839

Abstract of the Disclosure Electronic components are encapsulated with a calcium silicate-containing poly(arylene sulfide) composition. The composition can also contain a filler such as talc or silica and an organosilane such as 3-mercaptopropyltrimethoxysilane.

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