Encapsulation of electronic components with poly(arylene...

Details Encapsulation of electronic components with poly(arylene... Encapsulation of electronic components with poly(arylene...

C - Chemistry, Metallurgy

08

L

356/143, 400/534

C08L 81/02 (2006.01) C08K 5/54 (2006.01) H01B 3/30 (2006.01)

Patent

CA 1230441

Abstract Electronic components can be encapsulated with a poly(arylene sulfide) composition containing a mercaptosilane such as, for example, 3-mercaptopropyltrimethoxysilane.

429621

Affiliated with

Also associated with

Rating

Encapsulation of electronic components with poly(arylene... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulation of electronic components with poly(arylene..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation of electronic components with poly(arylene... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1237159