Encapsulation of high voltage mechanism to prevent fracture...

Details Encapsulation of high voltage mechanism to prevent fracture... Encapsulation of high voltage mechanism to prevent fracture...

H - Electricity

01

L

H01L 41/02 (2006.01)

Patent

CA 2106815

Structure is disclosed for a piezoelectric high voltage impact device which prevents fracture of the piezoelectric element contained therein. A tape is applied to the surface of the piezoelectric element and wrapped therearound. If the piezoelectric element becomes fractured as a result of actuation thereof, the tape provides support to the element permitting continued use of the device. A viscid encapsulating material can be used within the device so as to act in conjunction with the tape to further support the piezoelectric element permitting continued use of the impact device after fracture of the element has occurred.

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