Encapsulation of telecommunications cable splices

Details Encapsulation of telecommunications cable splices Encapsulation of telecommunications cable splices

H - Electricity

02

G

26/136, 337/47

H02G 15/00 (2006.01) H02G 1/14 (2006.01) H02G 15/10 (2006.01) H02G 15/117 (2006.01)

Patent

CA 1127255

Abstract of the Disclosure A cable splice formed by wrapping an electrical connection in sealing tape and injection moulding an encapsulation on the connection. The sealing tape is formed of material (e.g. ethylene propylene rubber) which softens under the influence of the injection moulding temperature, and is shaped intimately into fluid-tight sealing contact with the electrical connection by shrinkage of the encapsulation during cooling. The material of the sealing tape is also heat insulating to resist increase in temperature of the insulated conductors within the cable during the injection moulding process. - i -

347531

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