Enclosed electronic ballast housing

H - Electricity – 02 – B

Patent

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Details

H02B 1/26 (2006.01)

Patent

CA 2624571

The enclosed electronic ballast housing provides improved convection heat transfer for lowering the ambient housing temperature for keeping the junction temperature of power semiconductors inside the enclosed electronic ballast housing within certain specified temperature ranges for long-term reliable operation. The enclosed electronic ballast housing includes at least one folded fin on at least one of the enclosed electronic ballast housing surfaces, the folded fin may be manufactured from the same piece of material as the ballast housing for improved heat transfer. The folded fins are substantially parallel to their respective adjacent surfaces. Additionally, the enclosed electronic ballast housing includes separating portions of heat dissipating sections of ballast circuitry outside of the housing ballast.

L'invention concerne un logement de ballast électronique permettant un transfert de chaleur de convection amélioré abaissant la température ambiante du logement afin de maintenir la température de jonction des semi-conducteurs à l'intérieur du logement du ballast électronique dans certaines plages de températures spécifiques permettant un fonctionnement fiable à long terme. Le logement de ballast électronique comprend au moins une nervure pliée sur au moins une de ses surfaces, la nervure pliée pouvant être fabriquée à partir du même matériau que le logement du ballast pour améliorer le transfert thermique. Les nervures pliées sont sensiblement parallèles aux surfaces adjacentes correspondantes. Le logement du ballast électronique comprend, de plus, des parties de séparation des sections de dissipation thermique du circuit du ballast à l'extérieur du ballast.

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