B - Operations – Transporting – 05 – C
Patent
B - Operations, Transporting
05
C
32/1
B05C 11/10 (2006.01) B05C 5/02 (2006.01)
Patent
CA 1045372
Abstract of the Disclosure System and application head for depositing adhesives on surfaces to be bonded. The system in- cludes a supply of adhesive and a pump for urging the adhesive through an outlet line leading from the adhesive supply. A regulator is situated in the adhesive outlet line to provide a substantially constant pressure in the adhesive flow to the down- stream system components. An adhesive valve controls delivery of the adhesive to the application head. Means are provided for sensing when the surface to be bonded is in position adjacent to the application head to actuate a timer for controlling the valve whereby adhesive flows to the head for a predetermined period of time. Reverse pressure is then imposed to withdraw adhesive from the application head. The adhesive is deposited on the surface to be bonded during the time when the application head and the surface to be bonded are in cooperation. The head includes internal passages for directing adhesive therethrough to be applied to the surfaces to be bonded. An automatic flushing feature may be included upstream of the adhesive valve for fast removal of fast curing adhesives from the system after application thereof.
217480
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