Enhanced cleaning procedure for copper alloy equipment

B - Operations – Transporting – 08 – B

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B08B 3/00 (2006.01) C02F 5/08 (2006.01) C23G 1/10 (2006.01)

Patent

CA 1280057

ABSTRACT OF THE DISCLOSURE There is disclosed a method and additives to be employed in said method whereby the fouling of metal surfaces with copper deposits resulting from acid cleaning of copper alloy surfaces, be they all of the same metallurgy or merely elements within the overall system is markedly reduced by adding to the rinse or flush formulations commonly employed following an acid treatment, a chelating agent for copper, and, subsequently adding a copper corrosion inhibitor to the conventional neutralization fluid.

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