Enhanced condensation heat transfer device and method

Details Enhanced condensation heat transfer device and method Enhanced condensation heat transfer device and method

F - Mech Eng,Light,Heat,Weapons

28

F

257/26

F28F 7/00 (2006.01) F25J 3/00 (2006.01) F28F 13/04 (2006.01) F28F 13/18 (2006.01)

Patent

CA 1079264

Abstract of the Disclosure A metal substrate is provided with a single layer of randomly distributed metal bodies bonded to the substrate, spaced from each other and substantially surrounded by the substrate to form active condensation heat transfer surface and body void space.

286168

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