Enhanced mounting pads for printed circuit boards

Details Enhanced mounting pads for printed circuit boards Enhanced mounting pads for printed circuit boards

H - Electricity

05

K

H05K 1/02 (2006.01) H05K 1/11 (2006.01) H05K 1/18 (2006.01) H05K 3/00 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2273754

There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.

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