C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
18/1041, 154/140
C08L 27/08 (2006.01) B29C 55/12 (2006.01) B32B 27/08 (2006.01) B32B 27/30 (2006.01) C08J 5/18 (2006.01) C08K 3/32 (2006.01) C08K 5/1515 (2006.01) C08K 5/523 (2006.01) C08L 23/28 (2006.01) C08L 23/30 (2006.01)
Patent
CA 2018596
ABSTRACT OF THE DISCLOSURE This invention relates to films made from vinylidene chloride copolymers. Specifically, this invention relates to a method and composition for lowering the oxygen permeability and enhancing the thermal stability and enhancing the melt shear stability of packaging films having a layer of vinylidene chloride copolymer film by adding a processing aid such as an epoxy resin to vinylidene chloride copolymer of low molecular weight. The conventional stabiliza- er/plasticizer combination of epoxy resin and 2-ethyl-hexyl diphenyl phosphate may be employed with the vinylidene chlo- ride copolymer. The layer of vinylidene chloride copolymer can be as thin as 0.18 mil. 5/890509.3/SPECFLDR
Smart & Biggar
W.r. Grace & Co.,-Conn.
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