Envelope for mailing of cards containing an embedded chip

Details Envelope for mailing of cards containing an embedded chip Envelope for mailing of cards containing an embedded chip

B - Operations, Transporting

65

D

B65D 27/00 (2006.01) B65D 27/14 (2006.01)

Patent

CA 2507062

A new mailing envelope for use in mailing of a rigid module that is embedded in a plastic or non-plastic substrate.

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