Environmentally isolated enclosure for electronic components

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01) H05K 7/14 (2006.01)

Patent

CA 2288099

A spray cooled enclosure and method for obtaining a substantially improved operating environment for at least one electronic component/card located within the enclosure. The spray cooled enclosure includes a closed compartment that isolates the electronic components/cards from the environment. A dielectric heat transfer fluid stored within the closed compartment is distributed by a spraying system such that a thin-film layer of the heat transfer fluid is continually formed over a substantial portion of the surfaces of the electronic components/cards resulting in a substantially reduced thermal gradient across the electronic components/cards. Also included is closed-loop condensing system for condensing the heat transfer fluid vaporized in response to heat transferred from the electronic components/cards to the layer of heat transfer fluid.

L'invention porte sur une enceinte refroidie par pulvérisation et un procédé permettant d'obtenir des conditions ambiantes de fonctionnement sensiblement améliorées pour au moins un composant/carte électronique placé dans l'enceinte. Ladite enceinte comporte un compartiment fermé isolant le composant/carte électronique de l'extérieur. Un liquide diélectrique caloporteur stocké dans le compartiment fermé est distribué par un système de pulvérisation de manière à former continuellement une couche fine sur une partie substantielle de la surface du composant/carte électronique, ce qui produit un gradient thermique sensiblement réduit dans ledit composant/carte. L'invention porte également sur un système de condensation en circuit fermé condensant le liquide caloporteur vaporisé sous l'effet de la chaleur transférée du composant/carte électronique au liquide caloporteur.

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