Environmentally protected semiconductor chip package

Details Environmentally protected semiconductor chip package Environmentally protected semiconductor chip package

H - Electricity

01

L

356/143

H01L 23/057 (2006.01) H01L 21/50 (2006.01) H01L 21/60 (2006.01) H01L 23/498 (2006.01)

Patent

CA 1311857

LOW-COST HIGH-PERFORMANCE SEMICONDUCTOR CHIP PACKAGE Abstract of the Disclosure Disclosed is a low-cost high-performance semiconductor chip package enabling a direct chip to printed circuit board connection. The package comprises a semiconductor chip having a front surface and a back surface. The front surface comprises pads for input and output of signals to and from the chip. The package further comprises a leadframe having power, ground, and signal conductive elements having first and second end portions for transmitting input and output signals to the pads. The package also comprises a bonding system for selectively connecting the first end portions of the conductive elements to the pads and a protective system for providing sealed and environmental protection around the semiconductor chip and portions of the leadframe while permitting other portions of the leadframe to protrude from the protective means to provide connection with other devices.

613514

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