Epoxy-acrylate blend pressure-sensitive thermosetting adhesives

Details Epoxy-acrylate blend pressure-sensitive thermosetting adhesives Epoxy-acrylate blend pressure-sensitive thermosetting adhesives

C - Chemistry, Metallurgy

08

L

400/4704, 400/59

C08L 63/00 (2006.01) C08F 283/10 (2006.01) C09D 163/00 (2006.01)

Patent

CA 2009566

Abstract The invention relates to ~ pressure-sensitive thermosetting adhesive comprising from about 30% to about 80% by weight of a photopolymerizable monomer syrup containing an acrylic ester and a polar copolymerizable monomer, from about 20% to about 60% by weight of an epoxy resin or a mixture of epoxy resins containing no photo- polymerizable groups, from about 0.5% to about 10% by weight of a heat-activatable hardener for the epoxy resin, from about 0.01% to about 5% of a photoinitiator, and from 0% to about 5% of a photocrosslinking agent.

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